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PREPARED BY: S,,m
DATE:
/16/4?
I
-UAW30
ELECTRONIC
a-
I
GROUP
SPEC.No.
lx994049
1
COMFWENTS
LUKruKn 1 lUl-4
SPiKIFICATION
DEVICE SPECIFICATION FOR
Opto-Electronic
Devices
Division
Light Emitting Diode
MODEL No.
GL6ZR27
1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause. anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these speciiication sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these speciftcation sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment * Computers * Tooling machines L If the use of the product in the above application areas is for equipment listed in .paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Traffic signals * Gas leakage sensor breakers * Rescue and security equipment * Other safety equipment [ (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) * Medical equipment C * Nuclear power control equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: PRESENTED BY:
1
1
1
f9?q
/
JL4%
CUSTOMERS DATE:
APPROVAL
BY:
I M.Katoh, Department General Manager of Engineering Dept.Jll Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION
DO996049
IMODEL, No.
Jun/16/9!9
PAGE
GL6ZR27
l/10
GL6ZR27 Specification
1. Application This specificationappliesto the light emitting diodedevice Model No. GL6ZR27. [AlGaIS (dicing or scribe/braketype> Red LED device]
2. Outline dimensions pin connections and
. . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage2.
. 3. Ratingsandcharacteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-4. 3-l. Absolute maximumratings 3-2. Electra-optical characteristics 3-3. Dewing Curve 3-4. CharacteristicsDiagram
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5. 4- 1. Test itemsandtest conditions 4-2. Measurement itemsandFailure judgementcriteria
5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheetPage6. 5-1. Applied standard 5-2. Samplingmethodandlevel 5-3. Test items,judgementcriteria and classificaof defect 5-4. Test itemsthe surfaceis be appliedfor flat type, judgementcriteria and classificaof defect
6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..~ Refer to tbe attachedsheetPage7-8. 6-l. Packing 6-2. Luminousintensity rank 6-3. Dominantwavelengthrank 6-4. Erivironment
7. Precautionsfor use. . . . . . . . . . . . . . . . . . . . . . . . . . ..*.................. 7- 1. Lead forming method 7-2. Notice of installation 7-3. Soldering conditions .74. For cleaning
Refer to the attachedsheetPage9% 10.
DG996049
MODEL No.
I Jun/16/99 1PAGE
I
GL6ZR27
I
2/10
2. Outline dimensions and pin connections
5. 6 20. 2
Colorleis m, t
transparency
I
i
2. 54F'OM
~Jote)UnspeciEedtol. to be *02mm
Pin cont&ions a. Amxle 0. cathode
Note) Cold rolled steelleadsareplated with but the tie-bar cut portions haveno plating do not sol&r this part of the product. unit mm Material Lead : (Fe) Cold rolled steel Package: Epoxy resin Fish I Lead : Sn platedor wave soldering I I Drawing No. 51106030
DG996049 MODEL No. GL6ZR27
Jun/16/9! PAGE 3110
3. Ratings and charactekstics
(Note 1) Duty ratio=l/lO,Pulse width=O.lms (Note 2) At the position of 1.6mm from the bottom resin package
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
60
3 IL ; f = 2 7 L i
5o 40 30 20 10
0
.25 0 Ambient 25 50 75 a5 loo TarC) 125 -25 0 Ambient 25 50 Temperature 75a5100 TarC) 125 Temperature
DG996049 MODEL No.
GL6ZR27
Junl16/!w PAGE 4110
Peak
Forward
Current
vs.
Duty
Ratio
(Ta=25%)
10 l/100 l/10 Duty Raito 1 DR 10
34. cl haracteristics Diagram(typ) (Note 1)
Forward Current vs.Forward Voltage (Ta=25"C) 100 Relative Luminous intensity vs. Ambient Temperature (IF=2OmA)
10
1
0. 1 1 1.2 1.4 Forward 1.6 1.6 Voltage 2 2.2 VF(V) 2.4 2.6
10 -60-40-20 Ambient 0 20 40 Temprature 60 60 Ta("C)100120
Relative
Luminous
Intensity
vs.
Frorard
Voltage
(Ta= d5"c)
10
s O.E ?5 5 -I .-P z
1
0. 1
0.01 0. 1 Forward 1 Current 10 IFhA) 100
(Note 1) Above characteristic data are typical data and not a guarantteed data.
DG996049
MODEL No.
Jud16i99
PAGE
GL6ZR27
1
S/10
4. Reliability The reliability of productsshagbe satisfiedwith itemslistedbelow. 4- 1. Test itemsand testconditions Test items Solderability Soldering temperature Mechanicalshock Variable frequency vibration Terminal strength (Tension) Terminal strength (Bending) Temperature cycling High temp*andhigh humidity storage I 230f5=C, 5s Prior diisition 260+5"c, 5s 15OOO&, 0.5ms. 3times/ kXSY$Z direction 2OOm/s*, to 2 0OO lOOHz/sweep 4min. 100 to for ,4times/fX~Y,fZ direction Weight:lON, Ss/each terminal Weight:SN, 0" ---*90" -B O"* -90" + 0" /each terminal -40"c(3Or11in)~+l0O"c(3Omin),30cycles Test conditions : Dip in rosin flux Confidencelevel: 90% LTPD Samples (n) Defective (C) (Q/g) rl=ll,C=O n=ll,C=O n=ll, C=O n=ll, C=O n=ll,C=0 n=ll. C=O 20 20 20 20 20 20 10 10 10 I I 10 10 I I
I
I I
n=22, C=O n=22, C=O n=22, C=O n=22. C=O n=22, C=O
I
I
Ta=+60"C. 9O%RH, t=lO0Oh
I-l temperature tigh storage Ta=10O"C,t=lOOOh Low temperature storageTa=-40"C, t=lO0Oh I Operationlife Ta=25"C, &MAX, t=lOO0h *3 I
4-2. Measurement itemsand Failurejudgementcriteria * 1 Measurement Forward voltage Reversecurrent I+rninous intensity SjTIlbOl VF
IR
Failurejudgementcriteria *2 v, > U.S.L. x 1.2 IR > U.S.L. x 2.0 Iv > The first stagevalue X 2.0 or The first stagevalue X 0.5 > Iv
IV
z Solderability : Soldershallbe adhereat the areaof 95% or moreof dippedportion. s Terminal strength: Packageis not destroyed, and termi.naiis not slack. * 1: Measuringcondition is in accordance with specification. *2: U.S.L. is shownby Upper Specification Limit. *3: IF MAX.is shownby forward current of absolutemaximumratings.
DG996049 MODEL No. GL6ZR27
Jun/16/99 PAGE 6110
5. Incoming inspection 5- 1. Applied standard : IS0 2859-l 5-2. Sampling method and level : A single sampling plannormal inspection level II : AQL Major defect : 0.065% Minor defect : 0.4% 5-3. Test items, judgement criteria and classifica of defect No. 1 2 3 4 5 6 7 8 9 10 11 12 13
material
Test items Disconnection Position of Cutting off rim Reverse terminal Outline dimensions characteristics Cut off the rim Foreign substance Scratch Void Uneven density of for scattering
judgement criteria Not emit light Different from dimension Different from dimension Not satisfy outline specification Over the limit value of specification at Vr, Ia, and Iv Exceed -0.2mm White point : Exceed 4 0.3mm (on top view) Black point : Exceed 4 0.3mm (on top view) String form : Exceed 3.Omm (on top view) Exceed 4 0.3mm or O.lmm x LOnun (on top view) Exceed 4 0.3mm (on top view) Extremely uneven density Exceed fo.25mm from package center Exceed +0.2mm againstprovided dimension Insertion position of terminal
classifica of defec
Major defect
Minor defect
Unbalanced center Burr Insertion position of terminal
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect No. 14 15 Test items Chapped the surface Hollow the surface judgement criteria The surface chapped is striking for see the lamp top The surface hollow is striking for see the lamp top classifica of defect Minor defect
DG996049 MODEL No. GL6ZR27
Junl16/99 PAGE 7110
6. Supplement 6-l. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack. Product weight : 0.28g (One Product,Typ.) (Indication label sample) SHIPRHNT TABLE - Model number PART No. GL6ZFt27 *! q --00000 CUNTITY 250 - Quantiv of products LM No. KA99B19 - Lot number * 0 0 Q@Q Cl-Cl cLuminous intensity rank dominant wavelength rank SHARP' MADE IN JAPAN + Production country 0 @ @ @ @ production plant code@ be indicated alphabetically) Support code Year of production(the last two figures of the year) (to be indicated alphabetically with January corresponding to A) Month of production Date of production(01 cy 3 1)
6-l-2. Outer package Put 8 packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. Outer package out line dimension Width : 14Omm, Depth : 225mm. Night : !%nm
(Note 1) Tolerance:flS% In regard to luminous intensity , the following ranking shall be carried out. However the quantity of each rank shall not he pre scribed. In case of the distribution of the luminous intensity shift to high, at that point new upper rank is prescribed and lower rank is delete. 6-3.Dominant Rank I Y Z 1 2 3 wavelength rank (Note 2) Dominant wavelength I 1 1 1 1 I 628.5 631.5 634.5 637.5 640.5 632.5 635.5 638.5 641.5 644.5 Ta=25"C) Condition
1
unit
I
1
run
ItF2cmA
(Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp. This rank value is the setting value of when that classifies it the rank and be not a guarantee value. Also I shall not ask the delivery ratio of each rank.
I
m6049
Jud16/99
PAGE
MODEL No. GL6ZR27
8110
64. Environment 641. Ozonosphere destructive chemicals. (1) The &vice doesn't contain following substance. (2) The &vice doesn't have a production line whose processrequires following substance. Restricted pk CFCs,halones,CCl+TrichloroethsWMethychloroform) 6-4-2. Bromic non-burning materials The &vice doesn't contain bromic non-burning materials(PBBO~BBs)
DG996049 MODEL No. GL6ZRZ7
Jud16/!?
PAGE
9/10
7. Precautions use for
7 - 1. Lead fowing method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. 7 - 2. Notice of installation 7-2-l installation on a P W B Khen mounting an LED lamp on a P'RB,donot apply physical stress to the lead pins. The lead pin pitch should match the PVBpin-hole pitch:absolutely avoid widening or narrowing the lead pins. Whenpositioning an LED lamp,basically employ an LEDwith tie-bar cut or use a spacer. 7-2-2 Whenan LED 1 is mounted directly on. a P W B If the bottom face of an LED lamp is mounted directly on single-sided Pm,the base of the lead pins may be subjected to physical stress due to PVBwarp, cutting or clinching of lead pins. Prior to use, be sure to check that no disconnection inside of the resin or damageto resin etc., is found. Whenan LED lamp is mounted on a double-sided PIVB,theheat during soldering affects the resin;therefore,keep the LED lamp more that 1.6ma afloat above the PIVB. 7-2-3 Installation using a holder During an LEDlamp positioning,when a holder is used, a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-Z-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure.A hole of the case should be designed not to subject the inside of resin to any undue stress.
l l
Good
.
r MODEL. No.
lx996049 CL62227
Jud16/99 PAGE lO/lO
7 - 3. S oldering Conditions Solder the lead pins under the following conditions C ondi tions Type of Soldering 295C+5"c, within 3 seconds 1. Manual soldering 260C *S"c. within 5 seconds 2. Wave soldering Preheating 70C to 8O"C, within 30 seconds 3. Auto soldering Soldering 245"c+5"c, within 5 seconds (Note) Avoid dipping resin into soldering bath. Avoid applying stress to lead pins while they are heated-For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair, disconnection way occur.
bldcrinr
iroe
7 - 4. For cleaning
( 1) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 min or less
( 2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output, cleaning time, P'WB or device mounting size condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. ( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent is u&xi, there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition.

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